YQXPOLYMER Epoxy resin for Electronics, consisting of Bisphenol-A Liquid Epoxy Resin, Bisphenol-A Low Molecular Weight Liquid Epoxy Resin, Bisphenol-A Semi-solid Epoxy Resin, and High Bromine Solid Epoxy Resin, exhibits excellent electrical properties (e.g. electrical insulation), high structural strength, good sealing properties, good chemical stability; whose are comprehensively applicable into casting of insulating packages for electrical engineering and motors; potting and insulating of electronic components; epoxy lamination of semiconductor components; epoxy insulating coatings, insulating adhesives and electrical adhesives, etc.
Bisphenol-A Liquid Epoxy Resin 0161
Key Properties
- Low viscosity
- Light color
- Excellent wettability
Key Applications
- Reactor
- Insulating Paint
Bisphenol-A Liquid Epoxy Resin 0161 Grads
| Epoxy (g/mol) | Viscosity (mPa.s)(25°C) | Color | Hydrolysable Chlorine（%） | |
| 0161 | 175~185 | 8000~11000 | ≤40 | ≤0.05 |
Bisphenol-A Liquid Epoxy Resin 0164
Key Properties
- Good adhesion, fluidity and permeability
- Anti-cracking
- Professional, fast, and comprehensive technical application services
- Packing variety: barrels, tanks, or customization
Key Applications
- Insulator pouring material
- Casting material for dry type transformer
Bisphenol-A Liquid Epoxy Resin 0164 Grads
| Epoxy (g/mol) | Viscosity (mPa.s)(25°C) | Color | Hydrolysable Chlorine（%） | Notes | |
| 0164 | 183~190 | 10000~14000 | ≤30 | ≤0.05 | Standard type |
Bisphenol-A Liquid Epoxy Resin 0164D
Key Properties
- Low total chlorine to meet requirements of the E&E industry
- Low residual solution, low moisture content
- Excellent product quality, in line with the EU REACH, RoHS, Halogen Standard
Key Applications
- Electronic Packaging Material
- Package Sealing Material for Capacitor
Bisphenol-A Liquid Epoxy Resin 0164D Grads
| Epoxy (g/mol) | Viscosity (mPa.s)(25°C) | Color | Total chlorine (%) | |
| 0164D | 182~188 | 12000~16000 | ≤40 | ≤0.115 |
Bisphenol-A Low Molecular Weight Liquid Epoxy Resin 0164E
Key Properties
- Low hydrolysis chloride, high dielectric constant and low dielectric constant of curing material
- Low volatile, Excellent transparency and refractive index
- Low color, perfect appearance, excellent construction selectivity and applicability
Key Applications
- Package Sealing Material Capacitor
- potting compound for capacitor
Bisphenol-A Low Molecular Weight Liquid Epoxy Resin 0164E Grads
| Epoxy (g/mol) | Viscosity (mPa.s)(25°C) | Color | Hydrolyzable chlorine(%) | |
| 0164E | 184~194 | 11000~15000 | ≤30 | ≤0.030 |
Bisphenol-A Liquid Epoxy Resin 0164G
Key Properties
- Low volatile
- Low color decreasing the absolute value of yellow
- Low hydrolytic chlorine, excellent electrical properties
- Perfect appearance, stable quality
- Low light decay, prolonging the service life by 4% or more
Key Applications
- Potting Compound of LED
- Potting Material for Light Color Capacitor
Bisphenol-A Liquid Epoxy Resin 0164G Grads
| Epoxy (g/mol) | Color (Gardner) | Residual solvent (%) | Water content (%) | Hydrolyzable chlorine (%) | Viscosity (mPa.s)(25°C) | |
| 0164G | 184~190 | ≤20 | ≤0.010 | ≤0.040 | ≤0.020 | 11000~15000 |
Bisphenol-A Liquid Epoxy Resin 0164H
Key Properties
- Containing flexible groups, excellent resistance to cracking.
- Low hydrolysis chlorine, excellent electrical properties.
- High glass transition temperature, excellent heat resistance
Key Applications
- Voltage transformer
- High-voltage switch
- Insulator
Bisphenol-A Liquid Epoxy Resin 0164H Grads
| Epoxy (g/mol) | Color (Gardner) | Hydrolysable chlorine (%) | Viscosity (mPa.s)(25°C) | |
| 0164H | 184~195 | ≤50 | ≤0.050 | 16000~21000 |
Bisphenol-A Liquid Epoxy Resin 6101
Key Properties
- Low volatile, high solid content
- Excellent adhesive performance, excellent adhesion, high grade mechanical strength
- High performance price ratio. The qualification rates of customers’ products generally up 1%-5%
Key Applications
- Epoxy Insulation Board
Bisphenol-A Liquid Epoxy Resin 6101 Grads
| Epoxy (g/mol) | Color (Gardner) | Volatile matter(%,150°C,40min) | Softening point (°C) | |
| 6101 | 210~230 | ≤40 | ≤0.6 | 14~23 |
Bisphenol-A Semi-solid Epoxy Resin 0176
Key Properties
- Low hydrolysis chloride, good insulation properly and low dielectric constant of curing material
- Excellent adhesive properties and anti-cracking performance
Key Applications
- Pouring material for transformer
Bisphenol-A Semi-solid Epoxy Resin 0176 Grads
| Epoxy (g/mol) | Color (Gardner) | Hydrolysable chlorine (%) | Softening point (°C) | |
| 0176 | 240~250 | ≤30 | ≤0.050 | 27~35 |
High Bromine Solid Epoxy Resin 153-B
Key Properties
- Excellent flame retardant
- High grade electrical insulation
- Excellent machining performance
- stable quality
Key Applications
- Flame retardant CCl
- Flame EMC
High Bromine Solid Epoxy Resin 153-B grade
| Epoxy (g/mol) | Bromine content (%) | Softening point(°C) | |
| 153-B | 390~410 | 46~50 | 65~75 |
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